REV. B

–5–

AD9235

ABSOLUTE MAXIMUM RATINGS

1

With

Pin Name

Respect to Min

Max

Unit

ELECTRICAL

AVDD

AGND

–0.3

+3.9

V

DRVDD

DGND

–0.3

+3.9

V

AGND

DGND

–0.3

+0.3

V

AVDD

DRVDD

–3.9

+3.9

V

Digital Outputs

DGND

–0.3

DRVDD + 0.3

V

CLK, MODE

AGND

–0.3

AVDD + 0.3

V

VIN+, VIN–

AGND

–0.3

AVDD + 0.3

V

VREF

AGND

–0.3

AVDD + 0.3

V

SENSE

AGND

–0.3

AVDD + 0.3

V

REFB, REFT

AGND

–0.3

AVDD + 0.3

V

PDWN

AGND

–0.3

AVDD + 0.3

V

ENVIRONMENTAL

2

Operating Temperature

–40

+85

°C

Junction Temperature

150

°C

Lead Temperature (10 sec)

300

°C

Storage Temperature

–65

+150

°C

NOTES

beyond which the serviceability of the circuit may be impaired. Functional

operability is not necessarily implied. Exposure to absolute maximum rating

conditions for an extended period of time may affect device reliability.

θ

°C/W; (32-lead LFCSP),

θ

°C/W, θ

°C/W. These measurements were taken on a 4-layer

board in still air, in accordance with EIA/JESD51-1.

EXPLANATION OF TEST LEVELS

I

100% production tested.

II

100% production tested at 25

°C and sample tested at

specified temperatures.

III Sample tested only.

IV Parameter is guaranteed by design and characterization testing.

V

Parameter is a typical value only.

VI 100% production tested at 25

°C; guaranteed by design and

characterization testing for industrial temperature range;

100% production tested at temperature extremes for military

devices.

ORDERING GUIDE

Model

Temperature Range Package Description

Package Option

AD9235BRU-20

–40

°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

AD9235BRU-40

–40

°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

AD9235BRU-65

–40

°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

AD9235BCP-20

*

–40

°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32

AD9235BCP-40

*

–40

°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32

AD9235BCP-65

*

–40

°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32

AD9235-20PCB

TSSOP Evaluation Board

AD9235-40PCB

TSSOP Evaluation Board

AD9235-65PCB

TSSOP Evaluation Board

AD9235BCP-20EB

LFCSP Evaluation Board (Contact Factory)

AD9235BCP-40EB

LFCSP Evaluation Board (Contact Factory)

AD9235BCP-65EB

LFCSP Evaluation Board

*It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of

the package is achieved with exposed paddle soldered to the customer board.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD9235 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE