NCP398

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11

ORDERING INFORMATION

Device

Marking

Package

NCP398FCCT1G

AA

WLCSP4 0.84x0.84 mm

3000 Tape / Reel

NCP398MUTBG

AV

UDFN6 2x2 mm

3000 Tape / Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEA­

SURED BETWEEN 0.15 AND 0.25MM FROM THE TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE

TERMINALS.

5. TIE BARS MAY BE VISIBLE IN THIS VIEW AND ARE CONNECTED

TO THE THERMAL PAD.

SEATING

PLANE

0.10 C

A3

A

A1

0.10 C

UDFN6 2x2, 0.65P

CASE 517AB

ISSUE C

DIM

A

MIN

MAX

MILLIMETERS

0.45

0.55

A1

0.00

0.05

A3

0.127 REF

b

0.25

0.35

D

2.00 BSC

D2

1.50

1.70

0.80

1.00

E

2.00 BSC

E2

e

0.65 BSC

L

---

0.15

L1

PIN ONE

REFERENCE

0.08 C

0.10 C

6X

L

e

E2

b

3

6

6X

1

4

D2

BOTTOM VIEW

0.25

0.35

L1

DETAIL A

L

ALTERNATE TERMINAL

CONSTRUCTIONS

L

DETAIL B

MOLD CMPD

EXPOSED Cu

ALTERNATE

CONSTRUCTIONS

A1

A3

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.30

0.65

0.47

6X

DIMENSIONS: MILLIMETERS

0.40

1.70

PITCH

0.95

6X

1

PACKAGE

OUTLINE

RECOMMENDED

TOP VIEW

SIDE VIEW

DETAIL B

NOTE 4

DETAIL A

END VIEW

A

M

0.10

B

C

M

0.05

C

D

E

A B

NOTE 5

C