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NCP382HMN10A-ATXG Datasheet(PDF) 3 Page - ON Semiconductor

Part # NCP382HMN10A-ATXG
Description  Fixed Current-Limiting Power-Distribution Switches
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCP382HMN10A-ATXG Datasheet(HTML) 3 Page - ON Semiconductor

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NCP382
www.onsemi.com
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
From IN to OUT1, From IN to OUT2 Supply Voltage (Note 1)
VIN , VOUT1,VOUT2
−7.0 to +7.0
V
IN, OUT1,OUT2, EN1, EN2, FLAG1, FLAG2 (Note 1)
VIN, VOUT1, VOUT2, VEN1, VEN2,
VFLAG1, VFLAG2
−0.3 to +7.0
V
FLAG1, FLAG2 sink current
ISINK
1.0
mA
ESD Withstand Voltage (IEC 61000−4−2) (output only, when
bypassed with 1.0
mF capacitor minimum)
ESD IEC
15 Air, 8 contact
kV
Human Body Model (HBM) ESD Rating are (Note 2)
ESD HBM
2000
V
Machine Model (MM) ESD Rating are (Note 2)
ESD MM
200
V
Latch−up protection (Note 3)
− Pins IN, OUT1, OUT2, FLAG1, FLAG2
− EN1, EN2
LU
100
mA
Maximum Junction Temperature (Note 4)
TJ
−40 to + TSD
°C
Storage Temperature Range
TSTG
−40 to + 150
°C
Moisture Sensitivity (Note 5)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. According to JEDEC standard JESD22−A108.
2. This device series contains ESD protection and passes the following tests:
Human Body Model (HBM) +/−2.0 kV per JEDEC standard: JESD22−A114 for all pins.
Machine Model (MM) +/−200 V per JEDEC standard: JESD22−A115 for all pins.
3. Latch up Current Maximum Rating:
$100 mA per JEDEC standard: JESD78 class II.
4. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
5. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020.
OPERATING CONDITIONS
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VIN
Operational Power Supply
2.5
5.5
V
VENX
Enable Voltage
0
5.5
TA
Ambient Temperature Range
−40
25
+85
°C
ISINK
FLAG sink current
1
mA
CIN
Decoupling input capacitor
1
mF
COUTX
Decoupling output capacitor
USB port per Hub
120
mF
RqJA
Thermal Resistance Junction−to−Air
DFN−8 package (Notes 6 and 7)
140
°C/W
SOIC−8 package (Notes 6 and 7)
210
°C/W
TJ
Junction Temperature Range
−40
25
+125
°C
IOUTX
Recommended Maximum DC
current
DFN−8 package
2
A
SOIC−8 package
1.5
A
PD
Power Dissipation Rating (Note 8)
TA v 25°C
DFN−8 package
850
mW
SOIC−8 package
570
mW
TA = 85°C
DFN−8 package
428
mW
SOIC−8 package
285
mW
6. A thermal shutdown protection avoids irreversible damage on the device due to power dissipation.
7. The RqJA is dependent of the PCB heat dissipation. Announced thermal resistance is the unless PCB dissipation and can be improve with
final PCB layout.
8. The maximum power dissipation (PD) is given by the following formula:
P
D +
T
JMAX * TA
RqJA


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