4

HSMQ-Cxxx

Parameter

HSMR-Cxxx

Units

20

mA

Power Dissipation

78

mW

5

V

LED Junction Temperature

95

˚C

Operating Temperature Range

–30 to +85

˚C

Storage Temperature Range

–40 to +85

˚C

Soldering Temperature

See reflow soldering profile (Figures 11 & 12)

Device Selection Guide

InGaN Green

InGaN Blue

Package Description

3.2(L) x 1.0(W) x 1.5(H)

HSMQ-C110

HSMR-C110

Untinted, Non-diffused

1.6(L) x 0.6(W) x 1.0(H)

HSMQ-C120

HSMR-C120

Untinted, Non-diffused

1.6(L) x 0.8(W) x 0.35(H)

–

HSMR-C130

Untinted, Diffused

3.2(L) x 1.6(W) x 1.1(H)

HSMQ-C150

HSMR-C150

Untinted, Diffused

2.0(L) x 1.25(W) x 0.8(H)

HSMQ-C170

HSMR-C170

Untinted, Diffused

2.0(L) x 1.25(W) x 0.4(H)

HSMQ-C177

HSMR-C177

Untinted, Diffused

1.6(L) x 0.8(W) x 0.8(H)

HSMQ-C190

HSMR-C190

Untinted, Diffused

1.6(L) x 0.8(W) x 0.6(H)

HSMQ-C191

HSMR-C191

Untinted, Diffused

1.6(L) x 0.8(W) x 0.4(H)

HSMQ-C197

HSMR-C197

Untinted, Diffused

3.4(L) x 1.25(W) x 1.1(H)

HSMQ-C265

HSMR-C265

Untinted, Non-diffused

Notes: 1. Dimensions in mm.

2. Tolerance

± 0.1 mm unless otherwise noted.

Note: 1. Derate linearly as shown in Figure 4.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

Package Dimensions, continued

1.6

(0.063)

0.12 (0.005)

0.3 ± 0.15

(0.012 ± 0.006)

0.23 (0.009)

CATHODE

MARK

0.35 (0.014)

0.3 ± 0.15

(0.012 ± 0.006)

1.15

(0.045)

LED DIE

DIFFUSED EPOXY

PCB BOARD

0.8 (0.031)

CATHODE LINE

0.7 (0.028) MIN.

POLARITY

(0.625)

SOLDERING

TERMINAL

HSMx-C130

3.4 (0.134)

0.3 (0.012)

0.50 ± 0.15

(0.020 ± 0.006)

1.1 (0.043)

POLARITY

CATHODE

MARK (ETCHED)

1.1 (0.043)

0.50 ± 0.15

(0.020 ± 0.006)

1.2

(0.047)

1.25 (0.049)

LED DIE

UNDIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

GREEN SOLDER MASK

CATHODE LINE

HSMx-C265