TPS562219, TPS563219

SLVSCM7A – FEBRUARY 2015 – REVISED AUGUST 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

VIN, EN

–0.3

19

V

VBST

–0.3

25

V

VBST (10 ns transient)

–0.3

27.5

V

VBST (vs SW)

–0.3

6.5

V

Input voltage range

VFB, PG

–0.3

6.5

V

SS

–0.3

5.5

V

SW

–2

19

V

SW (10 ns transient)

–3.5

21

V

–40

150

°C

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply input voltage range

4.5

17

V

VBST

–0.1

23

VBST (10 ns transient)

–0.1

26

VBST(vs SW)

–0.1

6

EN

–0.1

17

Input voltage range

V

VFB, PG

–0.1

5.5

SS

–0.1

5

SW

–1.8

17

SW (10 ns transient)

–3.5

20

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

TPS562219

TPS563219

UNIT

DDF (8 PINS)

Junction-to-ambient thermal resistance

106.1

87.0

°C/W

Junction-to-case (top) thermal resistance

49.1

41.6

°C/W

Junction-to-board thermal resistance

10.9

14.6

°C/W

Junction-to-top characterization parameter

8.6

4.7

°C/W

Junction-to-board characterization parameter

10.8

14.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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