TPS650241-Q1, TPS650243-Q1, TPS650244-Q1

SLVS994A

– SEPTEMBER 2009 – REVISED MARCH 2011

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Input voltage range on all pins except A/PGND, VLDO1 and VLDO2 pins with respect to

–0.3 to 7

V

AGND

Voltage range on pins VLDO1 and VLDO2 with respect to AGND

–0.3 to 3.6

V

Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3

2000

mA

Peak current at all other pins

1000

mA

Continuous total power dissipation

See Dissipation Rating Table

Operating junction temperature

–40 to 125

°C

Storage temperature

–65 to 150

°C

Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds

260

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

DISSIPATION RATINGS

DERATING FACTOR

POWER RATING

POWER RATING

POWER RATING

RHB

35

°C/W

2.85 W

28 mW/

°C

1.57 W

1.14 W

(1)

The thermal resistance junction to ambient of the RHB package is measured on a high K board. The thermal resistance junction to

power pad is 1.5

°C/W.

2

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Product Folder Link(s): TPS650241-Q1 TPS650243-Q1 TPS650244-Q1