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UCD3138RMHT Datasheet(PDF) 5 Page - Texas Instruments |
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UCD3138RMHT Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 89 page  5 UCD3138 www.ti.com SLUSAP2G – MARCH 2012 – REVISED SEPTEMBER 2016 Submit Documentation Feedback Product Folder Links: UCD3138 Revision History Copyright © 2012–2016, Texas Instruments Incorporated 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (November 2013) to Revision G Page • Added Device and Documentation Support section and ESD Ratings table. ................................................. 2 • Changed document flow to match UCD3138A. ................................................................................... 2 • Added RJA package to Features and the Device Information table. .......................................................... 2 • Added RJA package. .............................................................................................................. 10 • Added the RJA package to the Thermal Information table. ................................................................... 13 Changes from Revision E (August 2013) to Revision F Page • Changed Top Side Marking info from " 3138 " to " 3138RMH " in the Ordering Information table. ..................... 13 Changes from Revision D (August 2013) to Revision E Page • Added UCD3138RMH to Feature bullet ........................................................................................... 1 • Added RMH package pinout drawing .............................................................................................. 9 • Added RMH package thermal specifications .................................................................................... 13 • Changed Global I/O registers ordered list, item 5 text from "Connecting pin/pins to high rail through internal pull up resistors." to "Configuring pin/pins as open drain or push-pull (Normal)" ................................................ 45 Changes from Revision C (March 2013) to Revision D Page • Changed TOPT spec to TJ in Abs Max table with MAX temp of 150°C ....................................................... 13 • Added BP18 Voltage vs Temperature graphic .................................................................................. 24 Changes from Revision B (July 2012) to Revision C Page • Deleted "JTAG Debug Port" feature bullet ........................................................................................ 1 • Deleted text string "JTAG debug" from Description section. .................................................................... 2 • Added NOTE under Functional Block Diagram ................................................................................... 3 • Deleted "JTAG" option from Product Selection Matrix. .......................................................................... 8 • Added text to Pin 54 description .................................................................................................. 11 • Added text to Pin 35 description .................................................................................................. 12 • Added BP18 spec to Abs Max Ratings and Recommended Operating Conditions Tables ............................... 13 • Deleted VDD specification from System Performance section of Electrical Characteristics................................ 15 • Added footnote to Table 5-1 ....................................................................................................... 16 • Added text string regarding front-end 2 in the Front End section ............................................................ 19 • Deleted text string reference to "JTAG port" in ARM Processor section ..................................................... 25 • Changed illustration in IC Grounding and Layout Recommendations section .............................................. 68 • Changed text strings in ............................................................................................................ 69 • Added document to References list ............................................................................................... 71 Changes from Revision A (March 2012) to Revision B Page • Added Feature bullets ................................................................................................................ 1 • Changed "Dual Edge Modulation" to "Triangular Modulation" in Features section .......................................... 1 • Changed "265 ksps" to "267 ksps" in Features section ......................................................................... 1 • Clarified number of UARTs in Feature section ................................................................................... 1 • Changed "FDPP" to "DDP" throughout. ........................................................................................... 2 • Changed Total GPIO pin count for the UCD3138 40-pin device from "17" to "18" in the Product Selection Matrix table. .................................................................................................................................... 8 • Changed "VREG" to "BP18" in conditions statement for Electrical Characteristics ........................................ 14 • Changed EAP – EAN Error voltage digital resolution MIN values for AFE = 3, AFE = 2, AFE = 1, AFE = 0 from 0.95, 1.90, 3.72, and 7.3 respectively; to, 0.8, 1.7, 3.55, and 6.90 respectively. ........................................... 14 |
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