4

REF6225, REF6230, REF6233, REF6241, REF6245, REF6250

SBOS748 – SEPTEMBER 2016

www.ti.com

Product Folder Links: REF6225 REF6230 REF6233 REF6241 REF6245 REF6250

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

–0.3

6

V

–0.3

V

–55

150

°C

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±1000

V

±250

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply input voltage

REF6225

3

5.5

V

REF6230, REF6233, REF6241, REF6245

5.5

REF6250

5.3

5.5

Enable voltage

0

V

Output current

REF6225, REF6230, REF6233, REF6241

–4

4

mA

REF6245

–3.5

3.5

REF6250

–3

3

Operating temperature

0

25

70

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

REF62xx

UNIT

DGK (VSSOP)

8 PINS

Junction-to-ambient thermal resistance

158.5

°C/W

Junction-to-case (top) thermal resistance

51.2

°C/W

Junction-to-board thermal resistance

79.5

°C/W

Junction-to-top characterization parameter

5.2

°C/W

Junction-to-board characterization parameter

78.0

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W