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TPS70633DBVT Datasheet(PDF) 4 Page - Texas Instruments

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Part # TPS70633DBVT
Description  150-mA, 6.5-V, 1-關A IQ Voltage Regulators with Enable
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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TPS706
SBVS245A – OCTOBER 2014 – REVISED MARCH 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
specified at TJ = –40°C to 125°C, unless otherwise noted; all voltages are with respect to GND
(1)
MIN
MAX
UNIT
VIN
–0.3
7
V
Voltage
VEN
–0.3
7
V
VOUT
–0.3
7
V
Maximum output current
IOUT
Internally limited
Output short-circuit duration
Indefinite
Continuous total power dissipation
PDISS
See Thermal Information
Junction temperature, TJ
–55
150
°C
Storage temperature, Tstg
–55
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
JEDEC document JEP155 states that 2-kV HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 500-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
2.7
6.5
V
VOUT
Output voltage
1.2
5
V
IOUT
Output current
0
150
mA
VEN
Enable voltage
0
6.5
V
CIN
Input capacitor
0
1
µF
COUT
Output capacitor
2
2.2
47
µF
TJ
Operating junction temperature
–40
125
°C
6.4 Thermal Information
TPS706
THERMAL METRIC(1)
DBV
DRV
UNIT
5 PINS
6 PINS
RθJA
Junction-to-ambient thermal resistance
212.1
73.1
RθJC(top)
Junction-to-case (top) thermal resistance
78.5
97.0
RθJB
Junction-to-board thermal resistance
39.5
42.6
°C/W
ψJT
Junction-to-top characterization parameter
2.86
2.9
ψJB
Junction-to-board characterization parameter
38.7
42.9
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
12.8
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Product Folder Links: TPS706


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