TPS780

SBVS083E – JANUARY 2007 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

+6.0

Voltage

–0.3

(2)

V

–0.3

Current

Internally limited

Output short-circuit duration

Indefinite

See Thermal Information

–40

125

°C

Temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage

2.2

5.5

V

Output voltage

1.8

4.2

V

Enable voltage

0

V

Output current

0

150

mA

Junction temperature

–40

125

°C

6.4 Thermal Information

TPS780xx

DDC

DRV

UNIT

5 PINS

6 PINS

Junction-to-ambient thermal resistance

193.0

65.9

Junction-to-case (top) thermal resistance

40.1

87.3

Junction-to-board thermal resistance

34.3

35.4

°C/W

Junction-to-top characterization parameter

0.9

1.7

Junction-to-board characterization parameter

34.1

35.8

Junction-to-case (bottom) thermal resistance

N/A

6.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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