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TPS76718QDR Datasheet(PDF) 5 Page - Texas Instruments |
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TPS76718QDR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 33 page TPS767 www.ti.com SLVS208J – MAY 1999 – REVISED AUGUST 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VI Input voltage range(2) –0.3 13.5 V Voltage range at EN –0.3 VI + 0.3 V Maximum RESET voltage 16.5 Peak output current Internally limited VO Output voltage (OUT, FB) 7 V Continuous total power dissipation See Thermal Information TJ Operating junction temperature range –40 125 °C Tstg Storage temperature range −65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network terminal ground. 7.2 ESD Ratings VALUE UNIT Electrostatic Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) V(ESD) 2000 V discharge (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VI (1) Input voltage 2.7 10 V VO Output voltage range 1.2 5.5 V IO (2) Output current 0 1.0 A TJ (2) Operating junction temperature –40 125 °C (1) Maximum VIN = VOUT + VDO or 2.7V, whichever is greater. (2) Continuous current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the device operate under conditions beyond those specified in this table for extended periods of time. 7.4 Thermal Information TPS767xxQ THERMAL METRIC(1) PWP (HTSSOP) D (SOIC) UNIT (20 PINS) (8 PINS) RθJA Junction-to-ambient thermal resistance 35.8 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 26.1 52.5 °C/W RθJB Junction-to-board thermal resistance 8.7 47.7 °C/W ψJT Junction-to-top characterization parameter 0.4 9.0 °C/W ψJB Junction-to-board characterization parameter 8.6 47.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 2.6 n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 1999–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 |
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