9

All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.

Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality

Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without

notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and

reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result

from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.

For information regarding Intersil Corporation and its products, see www.intersil.com

FN7388.7

September 8, 2005

FIGURE 19. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT

TEMPERATURE

633mW

QSOP16

1.2

1

0.8

0.6

0.4

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

125

85

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.2

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.45

0.4

0.25

0.15

0.1

0.05

0

0

255075

100

150

AMBIENT TEMPERATURE (°C)

85

391mW

SOT23-5/6

0.35

0.2

0.3

125

JEDEC JESD51-3 LOW EFFECTIVE THERMAL

CONDUCTIVITY TEST BOARD

0.6

0.4

0.3

0.2

0.1

0

0

255075

100

125

AMBIENT TEMPERATURE (°C)

85

0.5

MSOP8/10

486mW

EL5162, EL5163, EL5262, EL5263, EL5362