TPS7A4700, TPS7A4701

SBVS204F – JUNE 2012 – REVISED SEPTEMBER 2014

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6.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

–65

150

°C

Human body model (HBM), per

–1000

1000

TPS7A4700

V

Charged device model (CDM), per JEDEC

–500

500

Electrostatic

discharge

Human body model (HBM), per

–2500

2500

TPS7A4701

V

Charged device model (CDM), per JEDEC

–500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

3.0

35.0

V

1.4

34.0

V

0

V

0

1.0

A

6.4 Thermal Information

TPS7A47xx

RGW

UNIT

20 PINS

Junction-to-ambient thermal resistance

32.5

Junction-to-case (top) thermal resistance

27

Junction-to-board thermal resistance

11.9

°C/W

Junction-to-top characterization parameter

0.3

Junction-to-board characterization parameter

11.9

Junction-to-case (bottom) thermal resistance

1.7

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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