50.0

55.0

60.0

65.0

70.0

75.0

80.0

85.0

90.0

95.0

100.0

0.1

1

10

100

1000

Current (mA)

TPS82693

MODE = Low

G000

VIN

SW

FB

MODE

GND

EN

2.85 V @ 800mA

C

I

TPS82693SIP

L

C

O

MODE

SELECTION

ENABLE

DC/DC Converter

GND

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

TPS82692, TPS82693, TPS826951

TPS82697, TPS82698

SLVSBF8C – MARCH 2013 – REVISED MAY 2015

TPS8269x High-Efficiency MicroSIP™ Step-Down Converter (Profile <1mm)

1 Features

3 Description

The TPS8269xSIP device is a complete 500mA /

1

•

800mA, DC/DC step-down power supply intended for

•

95% Efficiency at 3MHz Operation

low-power applications. Included in the package are

•

23

μA Quiescent Current

the switching regulator, inductor and input/output

capacitors. No additional components are required to

•

High Duty-Cycle Operation

finish the design. The TPS8269xSIP is based on a

•

Best in Class Load and Line Transient

high-frequency

synchronous

step-down

dc-dc

•

±2% Total DC Voltage Accuracy

converter optimized for battery-powered portable

applications.

The

MicroSIP™

DC/DC

converter

•

Automatic PFM/PWM Mode Switching

operates at a regulated 3-MHz switching frequency

•

Low Ripple Light-Load PFM Mode

and enters the power-save mode operation at light

•

Excellent AC Load Regulation

load currents to maintain high efficiency over the

•

Internal Soft Start, 200-µs Start-Up Time

entire load current range. The PFM mode extends the

battery life by reducing the quiescent current to 23

μA

•

Integrated Active Power-Down Sequencing

(typ) during light load operation. For noise-sensitive

(Optional)

applications, the device has PWM spread spectrum

•

Current Overload and Thermal Shutdown

capability providing a lower noise regulated output, as

Protection

well as low noise at the input. These features,

•

Sub 1-mm Profile Solution

combined with high PSRR and AC load regulation

performance, make this device suitable to replace a

linear regulator to obtain better power conversion

2 Applications

efficiency. The TPS8269xSIP is packaged in a

•

Cell Phones, Smart-Phones

compact (2.3mm x 2.9mm) and low profile (1.0mm)

•

Optical Data Modules

BGA package suitable for automated assembly by

standard surface mount equipment.

•

Camera and Sensor Modules

•

Wearable Devices

Device Information

•

LDO Replacement

ORDER NUMBER

PACKAGE

BODY SIZE

TPS82692SIP

µSIP (8)

2,9mm × 2,3mm

TPS82693SIP

µSIP (8)

2,9mm × 2,3mm

TPS826951SIP

µSIP (8)

2,9mm × 2,3mm

TPS82697SIP

µSIP (8)

2,9mm × 2,3mm

TPS82698SIP

µSIP (8)

2,9mm × 2,3mm

.

Efficiency vs Output Current

4 Simplified Schematic

1

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.