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TPS79933DDCTG4 Datasheet(PDF) 1 Page - Texas Instruments |
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TPS79933DDCTG4 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 41 page TPS799xx GND EN NR IN OUT V IN V OUT Optional input capacitor. May improve source impedance, noise, or PSRR. Optional bypass capacitor to reduce output noise and increase PSRR. 2.2mF Ceramic V EN TPS79901 GND EN FB IN OUT V IN V OUT R 1 C FB R 2 Optionalinputcapacitor. Mayimprovesource impedance,noise,orPSRR. V = OUT ´ 1.193 (R 1 2 +R ) R 2 V EN 2.2 F m Ceramic Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPS799 SBVS056K – JANUARY 2005 – REVISED JANUARY 2015 TPS799 200-mA, Low-Quiescent Current, Ultralow Noise, High-PSRR Low-Dropout Linear Regulator 1 Features 3 Description The TPS799 family of low-dropout (LDO), low-power 1 • 200-mA Low-Dropout Regulator With EN linear regulators offers excellent ac performance with • Multiple Output Voltage Versions Available: very low ground current. High power-supply rejection – Fixed Outputs of 1.2 V to 4.5 V Using ratio (PSRR), low noise, fast start-up, and excellent Innovative Factory EEPROM Programming line and load transient response are provided while consuming a very low 40- μA (typical) ground current. – Adjustable Outputs from 1.20 V to 6.5 V The TPS799 is stable with ceramic capacitors and • Inrush Current Protection with EN Toggle uses an advanced BiCMOS fabrication process to • Low IQ: 40 μA yield a dropout voltage of typically 100 mV at a • High PSRR: 66 dB at 1 kHz 200-mA output. The TPS799 uses a precision voltage • Stable with a Low-ESR, 2- μF Typical Output reference and feedback loop to achieve an overall Capacitance accuracy of 2% over all load, line, process, and temperature variations. The TPS799 features inrush • Excellent Load and Line Transient Response current protection when the EN toggle is used to start • 2% Overall Accuracy (Load, Line, and the device, immediately clamping the current. Temperature) All devices are fully specified over the temperature • Very Low Dropout: 100 mV range of TJ = –40°C to 125°C, and offered in a low- • Package: 5-Bump, Thin, 1-mm × 1.37-mm profile, die-sized ball grid array (DSBGA) package, DSBGA ideal for wireless handsets and WLAN cards. 2 Applications Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) • Cellular Phones SOT (5) 2.90 mm x 1.60 mm • Wireless LAN, Bluetooth® TPS799 SON (6) 2.00 x 2.00 mm • VCOs, RF DSBGA (5) 1.57 mm x 1.20 mm • Handheld Organizers, PDAs (1) For all available packages, see the orderable addendum at the end of the data sheet. Typical Application Circuit Typical Application Circuit Fixed Voltage Versions Adjustable Voltage Version 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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