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TPS92511DDA Datasheet(PDF) 4 Page - Texas Instruments |
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TPS92511DDA Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page TPS92511 SNVS901A – MARCH 2014 – REVISED MAY 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) Unless otherwise specified, TJ = TA = 25°C MIN NOM MAX UNIT VIN to GND –0.3 65 V VIN to GND (Transient) –0.3 67 V LX to PGND –0.3 65 V Pin voltage range LX to PGND (Transient) –3(2ns) 67 V FS, IADJ to GND –0.3 5 V DIM to GND –0.3 6 V VCC to GND –0.3 7 V Internally Temperature range Operating junction temperature range, TJ –40 °C limited (1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For specified specifications and test conditions, see the Electrical Characteristics. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range -65 150 °C VESD (1) Human Body Model (HBM) ESD stress voltage (2) 1.5 kV Charged Device Model (CDM) ESD stress voltage(3) 1.5 kV (1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device. (2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT VIN Supply voltage range 4.5 65 V TA Operating free air temperature –40 125 °C TJ Operating junction temperature -40 125 °C 6.4 Thermal Information TPS92511 THERMAL METRIC(1) DDA UNIT 8 PINS RθJA Junction-to-ambient thermal resistance 59.9 RθJCtop Junction-to-case (top) thermal resistance 59.1 RθJB Junction-to-board thermal resistance 30.6 °C/W ψJT Junction-to-top characterization parameter 11.0 ψJB Junction-to-board characterization parameter 30.5 RθJCbot Junction-to-case (bottom) thermal resistance 4.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Product Folder Links: TPS92511 |
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