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TS3A226EYFFR Datasheet(PDF) 9 Page - Texas Instruments |
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TS3A226EYFFR Datasheet(HTML) 9 Page - Texas Instruments |
9 / 11 page www.ti.com EXAMPLE BOARD LAYOUT 9X ( 0.23) (0.4) TYP (0.4) TYP ( 0.23) METAL 0.05 MAX SOLDER MASK OPENING METAL UNDER SOLDER MASK ( 0.23) SOLDER MASK OPENING 0.05 MIN DSBGA - 0.625 mm max height YFF0009 DIE SIZE BALL GRID ARRAY 4219552/A 05/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). SYMM SYMM LAND PATTERN EXAMPLE SCALE:30X C 1 2 3 A B NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE SOLDER MASK DEFINED |
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