 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
TSC2013QPWRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
|
|
||||||||||||||||||||||||||||||
TSC2013QPWRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
|
|
4 / 70 page  TSC2013-Q1 SLVSC89A – JUNE 2014 – REVISED JULY 2014 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) Over operating free-air temperature range (unless otherwise noted). MIN MAX UNIT Analog input X+, Y+, AUX to SNSGND –0.4 SNSVDD + 0.1 V Analog input X–, Y– to SNSGND –0.4 SNSVDD + 0.1 V SNSVDD to SNSGND –0.3 5 V Voltage SNSVDD to AGND –0.3 5 V I/OVDD to AGND –0.3 5 V SNSVDD to I/OVDD –2.4 0.3 V Digital input voltage to AGND –0.3 I/OVDD + 0.3 V Digital output voltage to AGND –0.3 I/OVDD + 0.3 V Power dissipation (TJmax – TA) / RθJA Operating free-air temperature range, TA –40 125 °C Junction temperature, TJmax 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute- maximum rated conditions for extended periods may affect device reliability. 6.2 Handling Ratings MIN MAX UNIT Tstg Storage temperature range –65 150 °C Human body model (HBM), per AEC Q100-002(1) –2000 2000 Corner pins (RSA: 1, 4, 5, V(ESD) Electrostatic discharge 8, 9, 12, 13, and 16; –750 750 V Charged device model (CDM), PW: 1, 8, 9, and 16) per AEC Q100-011 Other pins –500 500 IEC contact discharge(2) X+, X–, Y+, Y– –15 15 kV IEC air discharge(2) X+, X–, Y+, Y– –25 25 kV (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. (2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Input voltage SNSVDD/VR 1.6 3.3 3.6 V Input voltage I/OVDD 1.2 3.3 3.6 V 6.4 Thermal Information RSA PW THERMAL METRIC(1) UNIT 16 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 33.7 100.9 °C/W RθJC(top) Junction-to-case(top) thermal resistance 36.7 36.1 °C/W RθJB Junction-to-board thermal resistance 10.5 45.7 °C/W ψJT Junction-to-top characterization parameter 0.6 2.6 °C/W ψJB Junction-to-board characterization parameter 10.5 45.1 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance 2.5 — °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated |
Similar Part No. - TSC2013QPWRQ1 |
|
Similar Description - TSC2013QPWRQ1 |
|
|
Link URL |
| Privacy Policy |
| ALLDATASHEET.NET |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
English ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
