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TF12S-13S-0.5SH Datasheet(PDF) 7 Page - Hirose Electric |
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TF12S-13S-0.5SH Datasheet(HTML) 7 Page - Hirose Electric |
7 / 7 page Revision#1 IC 기술팀 ■ Reflow Profile Using Lead-free Solder Paste 300 250 200 150 100 50 0 50 100 150 200 250 300 Recommended Application Conditions Reflow System: IR reflow Solder: Cream type Sn / 3 Ag / 0.5 Cu Flux content 11%wt Metal mask thickness: 0.15mm Preheating time: 150℃~190℃, 90±30seconds A'=150℃~170℃ , B'=170℃~190℃ Soldering time: 250℃ Max 220℃ Min, 30~60 seconds Time (Seconds) 250℃ Max 220℃ Preheating time Soldering time A' B' HIROSE KOREA Page7 2013/ FEBRUARY |
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