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TMS320F28234PTPS Datasheet(PDF) 6 Page - Texas Instruments |
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TMS320F28234PTPS Datasheet(HTML) 6 Page - Texas Instruments |
6 / 201 page 6 TMS320F28335, TMS320F28334, TMS320F28333, TMS320F28332 TMS320F28235, TMS320F28234, TMS320F28232 SPRS439N – JUNE 2007 – REVISED OCTOBER 2016 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F28335 TMS320F28334 TMS320F28333 TMS320F28332 TMS320F28235 TMS320F28234 TMS320F28232 Revision History Copyright © 2007–2016, Texas Instruments Incorporated 2 Revision History Changes from August 6, 2012 to October 18, 2016 (from M Revision (August 2012) to N Revision) Page • Global: Added TMS320F28333. ................................................................................................... 1 • Global: Restructured document. .................................................................................................. 1 • Global: Removed Reliability Data for TMS320LF24xx and TMS320F28xx Devices Application Report. ............... 1 • Global: Removed C2833x, C2823x C/C++ Header Files and Peripheral Examples. ...................................... 1 • Global: Replaced "CAN 2.0B" with "ISO 11898-1 (CAN 2.0B)". .............................................................. 1 • Global: Added SYS/BIOS. .......................................................................................................... 1 • Section 1.1 (Features): Removed "Dynamic PLL Ratio Changes Supported" feature. ..................................... 1 • Section 1.1: Updated JTAG Boundary Scan Support feature. ................................................................. 1 • Section 1.1: Updated Package Options feature. ................................................................................. 1 • Section 1.1: Added "(AEC Q100 Qualification for Automotive Applications)" to "Q" temperature option. ................ 1 • Section 1.2 (Applications): Added section. ....................................................................................... 2 • Section 1.3 (Description): Added section. ......................................................................................... 3 • Section 1.3: Added Device Information table. .................................................................................... 3 • Table 3-1 (F2833x Device Comparison): Changed title from "F2833x Hardware Features" to "F2833x Device Comparison". ......................................................................................................................... 8 • Table 3-1: Added data for F28333 device. ....................................................................................... 8 • Table 3-1: Changed "PWM outputs" to "PWM channels". ...................................................................... 8 • Table 3-1: Removed "Product status" row and associated footnote. ......................................................... 8 • Table 3-2 (F2823x Device Comparison): Changed title from "F2823x Hardware Features" to "F2823x Device Comparison". ......................................................................................................................... 9 • Table 3-2: Changed "PWM outputs" to "PWM channels". ...................................................................... 9 • Table 3-2: Removed "Product status" row and associated footnote. ......................................................... 9 • Section 3.1 (Related Products): Added section. ................................................................................ 10 • Section 4.1 (Pin Diagrams): Updated NOTE about PowerPAD. ............................................................. 12 • Section 5.2 (ESD Ratings – Automotive): Added section. .................................................................... 32 • Section 5.3 (ESD Ratings – Commercial): Added section. ................................................................... 32 • Section 5.5 (Power Consumption Summary): Changed section title from "Current Consumption" to "Power Consumption Summary". ........................................................................................................... 34 • Section 5.9.2 (Power Sequencing): Updated XRSn requirement #2. ....................................................... 44 • Table 5-23 (High-Resolution PWM Characteristics at SYSCLKOUT = (60–150 MHz)): Updated footnote. ............ 59 • Table 5-32 (SPI Master Mode External Timing (Clock Phase = 0)): Parameter 2: Updated parametric values. ....... 62 • Table 5-32: Parameter 3: Updated parametric values. ........................................................................ 62 • Table 5-32: Parameter 5: Updated parametric symbols and values. ......................................................... 62 • Table 5-32: Parameter 9: Updated parametric symbols, descriptions, and values. ........................................ 62 • Table 5-33 (SPI Master Mode External Timing (Clock Phase = 1)): Parameter 2: Updated parametric values. ...... 64 • Table 5-33: Parameter 3: Updated parametric values. ........................................................................ 64 • Table 5-33: Parameter 6: Updated parametric symbols, descriptions, and values. ....................................... 64 • Table 5-33: Parameter 7: Updated parametric symbols and values. ........................................................ 64 • Table 5-33: Parameter 11: Updated parametric symbols, descriptions, and values. ...................................... 64 • Table 5-34 (SPI Slave Mode External Timing (Clock Phase = 0)): Parameter 16 [tv(SPCL-SOMI)S, tv(SPCH-SOMI)S]: Changed MIN values to 0. ......................................................................................................... 66 • Table 5-35 (SPI Slave Mode External Timing (Clock Phase = 1)): Parameter 18 [tv(SPCL-SOMI)S, tv(SPCH-SOMI)S]: Changed MIN values to 0. ......................................................................................................... 68 • Section 5.9.4.6.2 (McBSP as SPI Master or Slave Timing): Replaced "For all SPI slave modes ..." paragraphs with "For all SPI slave modes ..." table footnotes. ............................................................................. 72 • Table 5-38 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)): Added "For all SPI slave modes ..." footnote. .................................................................................................... 72 • Table 5-40 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)): Added "For all SPI slave modes ..." footnote. .................................................................................................... 73 • Table 5-42 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)): Added "For all SPI slave modes ..." footnote. .................................................................................................... 74 • Table 5-44 (McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)): Added "For all SPI slave modes ..." footnote. .................................................................................................... 75 • Table 5-62 (Flash Parameters at 150-MHz SYSCLKOUT): Updated "Typical parameters as seen at room temperature ..." footnote ........................................................................................................... 95 • Section 6.2.7.3 (ADC Calibration): Updated section. ......................................................................... 131 |
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