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REG104FA-5KTTT Datasheet(PDF) 11 Page - Texas Instruments |
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REG104FA-5KTTT Datasheet(HTML) 11 Page - Texas Instruments |
11 / 22 page REG104 11 SBVS025G FIGURE 9. Maximum Power Dissipation versus Ambient Temperature for the Various Packages and PCB Heat Sink Configurations. POWER DISSIPATION The REG104 is available in two different package configura- tions. The ability to remove heat from the die is different for each package type and, therefore, presents different consid- erations in the printed circuit board (PCB) layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. While it is difficult to impossible to quantify all of the variables in a thermal design of this type, performance data for several configurations are shown in Figure 9. In all cases the PCB copper area is bare copper, free of solder resist mask, and not solder plated. All examples are for 1-ounce copper. Using heavier copper will increase the effectiveness in moving the heat from the device. In those examples where there is copper on both sides of the PCB, no connection has been provided between the two sides. The addition of plated through holes will improve the heat sink effectiveness. Power dissipation depends on input voltage and load condi- tions. Power dissipation is equal to the product of the aver- age output current times the voltage across the output element, VIN to VOUT voltage drop. PV V I DIN OUT OUT AVG =• ( – ) () Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage. 5 4 3 2 1 0 0 25 50 75 125 100 Ambient Temperature ( °C) CONDITIONS #1 #2 #3 #4 CONDITION PACKAGE PCB AREA θ JA 1 DDPAK 4in2 Top Side Only 27 °C/W 2 SOT-223 4in2 Top Side Only 53 °C/W 3 DDPAK None 65 °C/W 4 SOT-223 0.5in2 Top Side Only 110 °C/W |
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