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THS3110 Datasheet(PDF) 2 Page - Texas Instruments |
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THS3110 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 28 page www.ti.com 1 2 3 4 8 7 6 5 NC VIN − VIN + VS− NC VS+ VOUT NC D, DGN TOP VIEW D, DGN TOP VIEW NC = No Internal Connection 1 2 3 4 8 7 6 5 REF VIN− VIN+ VS− PD VS+ VOUT NC NC = No Internal Connection THS3110 THS3111 Note: The device with the power down option defaults to the ON state if no signal is applied to the PD pin. Additionallly, the REF pin functional range is from VS− to (VS+ − 4 V). DISSIPATION RATING TABLE THS3110, THS3111 SLOS422A – SEPTEMBER 2003 – REVISED NOVEMBER 2003 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling procedures and installation procedures can cause damage. AVAILABLE OPTIONS PACKAGED DEVICE TA PLASTIC SMALL OUTLINE SOIC (D) PLASTIC MSOP (DGN)(1)(2) SYMBOL THS3110CD THS3110CDGN 0 °C to 70°C BJB THS3110CDR THS3110CDGNR THS3110ID THS3110IDGN -40 °C to 85°C BIR THS3110IDR THS3110IDGNR THS3111CD THS3111CDGN 0 °C to 70°C BJA THS3111CDR THS3111CDGNR THS3111ID THS3111IDGN -40 °C to 85°C BIS THS3111IDR THS3111IDGNR (1) Available in tape and reel. The R suffix standard quantity is 2500 (e.g. THS3110CDGNR). (2) The PowerPAD is electrically isolated from all other pins. POWER RATING TJ = 125°C PACKAGE Θ JC (°C/W) Θ JA (°C/W) TA = 25°C TA = 85°C D-8(1) 38.3 95 1.05 W 421 mW DGN-8(2) 4.7 58.4 1.71 W 685 mW (1) This data was taken using the JEDEC standard low-K test PCB. For the JEDEC proposed high-K test PCB, the Θ JA is 95°C/W with power rating at TA = 25°C of 1.05 W. (2) This data was taken using 2 oz. trace and copper pad that is soldered directly to a 3 inch x 3 inch PCB. For further information, refer to the Application Informationsection of this data sheet. 2 |
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