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NCS2005SN1T1G Datasheet(PDF) 2 Page - ON Semiconductor

Part # NCS2005SN1T1G
Description  Operational Amplifier, Low Power, 8 MHz GBW Rail-to-Rail Input-Output
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCS2005SN1T1G Datasheet(HTML) 2 Page - ON Semiconductor

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NCS2005
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Table 1. PIN DESCRIPTION
Pin
Name
Type
Description
1
OUT
Output
Amplifier output
2
V−
Power
Negative power supply
3
IN+
Input
Non−inverting input of amplifier
4
IN−
Input
Inverting input of amplifier
5
V+
Power
Positive power supply
Table 2. ABSOLUTE MAXIMUM RATINGS (Note 1)
rating
Symbol
Value
Units
Supply Voltage Range (V+ − V−)
VS
0 to 35
V
Input Voltage Range
VCM
(V−) − 0.3 V to (V+) + 0.3 V
V
Differential Input Voltage Range
Vdiff
0 to 15
V
Input Pin Current
IIN
±10
mA
Output Pin Current (Note 2)
IOUT
±20
mA
Supply Current
Is
25
mA
Maximum Junction Temperature (Note 3)
TJ(max)
+150
°C
Storage Temperature Range
Tstg
−65 to +150
°C
ESD Capability (Note 4)
Human Body Model
Charged Device Model
HBM
CDM
4000
400
V
Moisture Sensitivity Level (Note 5)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Applies to both single supply and split supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150
°C.
3. The maximum power dissipation is a function of TJ(MAX), TJA, and TA. The maximum allowable dissipation at any ambient temperature is
Pd = (TJ(max) – TA)/TJA. All numbers apply for packages soldered directly to a PC board.
4. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per JESD22−A114
ESD Charged Device Model tested per ANSI/ESD S5.3.1−2009
5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J−STD−020A
Table 3. THERMAL CHARACTERISTICS
Parameter
Symbol
Package
Single Layer Board
Multi Layer Board
Units
Thermal Resistance Junction−to−Ambient (Note 6)
qJA
SOT−23−5
408 (Note 6)
355 (Note 7)
°C/W
6. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area
7. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
Table 4. OPERATING RANGES
Parameter
Symbol
Min
Max
Units
Power Supply Voltage
VS
2.2
32
V
Common Mode Input Voltage
VCM
(V−) − 0.1
(V+) + 0.1
V
Ambient Temperature
TA
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.


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