9

HV9123

Supertex inc.

www.supertex.com

Doc.# DSFP-HV9123

C031314

16-Lead SOIC (Narrow Body) Package Outline (NG)

9.90x3.90mm body, 1.75mm height (max), 1.27mm pitch

Symbol

A

A1

A2

b

D

E

E1

e

h

L

L1

L2

θ

θ1

Dimension

(mm)

MIN 1.35* 0.10

1.25

0.31

9.80* 5.80* 3.80*

1.27

BSC

0.25

0.40

1.04

REF

0.25

BSC

NOM

-

-

-

-

9.90

6.00

3.90

-

-

-

-

MAX 1.75

0.25 1.65* 0.51 10.00* 6.20* 4.00*

0.50

1.27

JEDEC Registration MS-012, Variation AC, Issue E, Sept. 2005.

* This dimension is not specified in the JEDEC drawing.

Drawings are not to scale.

Supertex Doc. #: DSPD-16SONG, Version G041309.

Top View

Side View

View A-A

View B

A

A

Seating

Plane

16

1

Seating

Plane

Gauge

Plane

L

L1

L2

θ1

θ

View B

h

h

b

A A2

A1

e

E

E1

D

Note 1

(Index Area

D/2 x E1/2)

Note:

1.

This chamfer feature is optional. If it is not present, then a Pin 1 identifier must be located in the index area indicated. The Pin 1 identifier can be:

a molded mark/identifier; an embedded metal marker; or a printed indicator.