ASM3P2107A

http://onsemi.com

2

Figure 1. Block Diagram

GND

XOUT

XIN

Crystal

Oscillator

PLL

VCO

Output

Divider

CLOCKOUT

Loop

Filter

Phase

Detector

Modulation

Feedback

Divider

Frequency

Divider

Table 1. PIN DESCRIPTION

Pin #

Pin Name

Type

Description

1

XIN / CLKIN

I

Crystal connection or external reference frequency input. This pin has dual functions. It can be

connected to either an external crystal or an external reference clock.

2

XOUT

O

Crystal connection. If using an external reference, this pin must be left unconnected.

3

GND

P

Ground to entire chip.

4

NC

−

No connect.

5

CLOCKOUT

O

Spread spectrum low EMI output.

6

VDD

P

Power supply for the entire chip (5 V).

7

NC

−

No connect.

8

NC

−

No connect.

Table 2. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Rating

Unit

Voltage on any pin with respect to Ground

−0.5 to +7.0

V

Storage temperature

−65 to +125

°C

Operating temperature

0 to 70

°C

Max. Soldering Temperature (10 sec)

260

°C

Junction Temperature

150

°C

Static Discharge Voltage (As per JEDEC STD22− A114−B)

2

KV

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.