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ISD5116P Datasheet(PDF) 5 Page - Winbond |
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ISD5116P Datasheet(HTML) 5 Page - Winbond |
5 / 57 page October 2000 Page 4 9I 2C Serial Interface Technical Information ..........................................................................47 9.1 Characteristics of the I 2C Serial Interface........................................................................47 9.2 I 2C Protocol......................................................................................................................49 10 Device Physical Dimensions ............................................................................................51 10.1. Plastic Thin Small Outline Package (TSOP) Type e Dimensions................................51 10.2. Plastic Small Outline Integrated Circuit (soic) Dimensions ..........................................52 10.3. Plastic Dual Inline Package (PDIP) Dimensions..........................................................53 10.4. Die Bonding Physical Layout........................................................................................54 11 Ordering Information.........................................................................................................56 |
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