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BD9E302EFJ Datasheet(PDF) 5 Page - Rohm |
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BD9E302EFJ Datasheet(HTML) 5 Page - Rohm |
5 / 44 page 5/41 Datasheet Datasheet BD9E302EFJ TSZ02201-0J3J0AJ00890-1-2 © 2016 ROHM Co., Ltd. All rights reserved. 27.Apr.2016 Rev.002 www.rohm.com TSZ22111•15•001 Absolute Maximum Ratings (Ta = 25 C) Parameter Symbol Rating Unit Supply Voltage VIN -0.3 to +30 V EN Input Voltage VEN -0.3 to VIN V Voltage from GND to BOOT VBOOT -0.3 to +35 V Voltage from SW to BOOT ⊿VBOOT -0.3 to +7 V FB Input Voltage VFB -0.3 to +7 V COMP Input Voltage VCOMP -0.3 to +7 V SW Input Voltage VSW -0.5 to VIN +0.3 V Operating Ambient Temperature Range Topr -40 to +85 C Storage Temperature Range Tstg -55 to +150 C Caution1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) Unit 1s(Note 3) 2s2p(Note 4) HTSOP-J8 Junction to Ambient θJA 206.4 45.2 °C/W Junction to Top Characterization Parameter(Note 2) ΨJT 21 13 °C/W (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Material Board Size Single FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70μm (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Material Board Size Thermal Via(NOTE 5) Pitch Diameter 4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt 1.20mm Φ0.30mm Top 2 Internal Layers Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70μm 74.2mm x 74.2mm 35μm 74.2mm x 74.2mm 70μm (Note 5) This thermal via connects with the copper pattern of all layers.. |
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