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TSZ02201-0252AAJ00010-1-2

© 2016 ROHM Co., Ltd. All rights reserved.

8.Jun.2016 Rev.001

www.rohm.com

TSZ22111

・15・001

BD9227F

Absolute Maximum Ratings (Ta=25°C)

Parameter

Symbol

Rating

Unit

VCC to GND

-0.3 to +22

V

VB to GND

-0.3 to +22

V

LX to GND

-2.0 to +22

V

VCC to LX

⊿V

LX

-0.3 to +22

V

VCC to VB

⊿V

B

-0.3 to +7

V

COMP to GND

-0.3 to +7

V

NON to GND

-0.3 to +7

V

FB to GND

-0.3 to +7

V

PWM to GND

-0.3 to +7

V

High-Side FET Drain Current

OCP

A

Power Dissipation

Pd

0.633

(Note 1)

W

Operating Temperature

Topr

-40 to +85

°C

Storage Temperature

Tstg

-55 to +150

°C

Junction Temperature

Tjmax

150

°C

(Note 1)

During mounting of 114.3×76.2×1.57

℃ increase. (Above 25℃)

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

Thermal Resistance

(Note 1)

Parameter

Symbol

Thermal Resistance (Typ)

Unit

1s

(Note 3)

2s2p

(Note 4)

SOP8

Junction to Ambient

197.4

109.8

°C/W

Junction to Top Characterization Parameter

(Note 2)

21

19

°C/W

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note3) Using a PCB board based on JESD51-3

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70

μm

(Note 4) Using a PCB board based on JESD51-7

Layer Number of

Measurement Board

Material

Board Size

Thermal Via

(Note 5)

Pitch

Diameter

4 Layers

FR-4

114.3mm x 76.2mm x 1.6mmt

1.20mm

Φ0.30mm

Top

2 Internal Layers

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70

μm

74.2mm x 74.2mm

35

μm

74.2mm x 74.2mm

70

μm

(Note 5) This thermal via connects with the copper pattern of all layers