Absolute Maximum Ratings

If MilitaryAerospace specified devices are required

please contact the National Semiconductor Sales

OfficeDistributors for availability and specifications

Supply Current

19 mA

Power Dissipation (Note 1)

1250 mW

Operating Temperature Range

b

Storage Temperature Range

b

Soldering Information

Dual-In-Line Package (10 sec)

260 C

Small Outline Package

Vapor Phase (60 sec)

215 C

Infrared (15 sec)

220 C

See AN-450 ‘‘Surface Mounting and Their Effects on Prod-

uct Reliability’’ for other methods of soldering surface

mount devices

Parameter

Conditions

Min

Typ

Max

Units

Power Supply Shunt

Pin 8 Average Value

22

26

30

V

Regulator Voltage

Latch Trigger Voltage

Pin 7

15

175

20

V

Sensitivity Set Voltage

Pin 8 to Pin 6

6

7

82

V

Output Drive Current

Pin 1 With Fault

05

1

24

mA

Output Saturation Voltage

Pin 1 Without Fault

100

240

mV

Output Saturation Resistance

Pin 1 Without Fault

100

X

Output External Current

Pin 1 Without Fault

20

5

mA

Sinking Capability

Noise Integration

Pin 7 Ratio of Discharge

Sink Current Ratio

Currents Between No Fault

20

28

36

m

A mA

and Fault Conditions

Parameter

Conditions

Min

Typ

Max

Units

Normal Fault Current

Figure 1 (Note 3)

3

5

7

mA

Sensitivity

Normal Fault Trip Time

500X Fault

Figure 2 (Note 2)

18

ms

Normal Fault with

500X Normal Fault

18

ms

Grounded Neutral Fault

2X Neutral

Figure 2 (Note 2)

Trip Time

Note 1

For operation in ambient temperatures above 25 C the device must be derated based on a 125 C maximum junction temperature and a thermal resistance

of 80 CW junction to ambient for the DIP and 162 CW for the SO Package

Note 2

Average of 10 trials

Note 3

Required UL sensitivity tolerance is such that external trimming of LM1851 sensitivity will be necessary

Note 4

This externally applied current is in addition to the internal ‘‘output drive current’’ source

TLH5177 – 2

FIGURE 1 Normal Fault Sensitivity Test Circuit

2