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OPA2325 Datasheet(PDF) 4 Page - Texas Instruments |
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OPA2325 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 32 page 4 OPA2325 SBOS637 – OCTOBER 2016 www.ti.com Product Folder Links: OPA2325 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be current limited to 10 mA or less. (3) Short-circuit to ground, one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VS = (V+) – (V–) 6 V Signal input pins Voltage(2) (V–) – 0.5 (V+) + 0.5 V Current(2) –10 10 mA Output short-circuit(3) Continuous mA Temperature Specified, TA –40 125 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Supply voltage Single supply 2.2 5.5 V Dual supply ±1.1 ±2.75 Specified temperature range –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) OPA2325 UNIT D (SOIC) 8 PINS RθJA Junction-to-ambient thermal resistance 119.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 59.5 °C/W RθJB Junction-to-board thermal resistance 61.1 °C/W ψJT Junction-to-top characterization parameter 15.0 °C/W ψJB Junction-to-board characterization parameter 60.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W |
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