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TLV3541, TLV3542, TLV3544

SBOS756 – OCTOBER 2016

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Product Folder Links: TLV3541 TLV3542 TLV3544

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Copyright © 2016, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.4 Thermal Information: TLV3541

TLV3541

UNIT

D (SOIC)

DBV (SOT-23)

8 PINS

5 PINS

Junction-to-ambient thermal resistance

123.8

216.3

°C/W

Junction-to-case (top) thermal resistance

68.7

84.3

°C/W

Junction-to-board thermal resistance

64.5

43.1

°C/W

Junction-to-top characterization parameter

23.0

3.8

°C/W

Junction-to-board characterization parameter

64.0

42.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.5 Thermal Information: TLV3542

TLV3542

UNIT

D (SOIC)

DGK (VSSOP)

8 PINS

8 PINS

Junction-to-ambient thermal resistance

113.9

175.9

°C/W

Junction-to-case (top) thermal resistance

60.4

67.8

°C/W

Junction-to-board thermal resistance

54.1

97.1

°C/W

Junction-to-top characterization parameter

17.1

9.3

°C/W

Junction-to-board characterization parameter

53.6

95.5

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).

6.6 Thermal Information: TLV3544

TLV3544

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

14 PINS

Junction-to-ambient thermal resistance

83.8

92.6

°C/W

Junction-to-case (top) thermal resistance

70.7

27.5

°C/W

Junction-to-board thermal resistance

59.5

33.6

°C/W

Junction-to-top characterization parameter

11.6

1.9

°C/W

Junction-to-board characterization parameter

37.7

33.1

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W