WL1837MODGIMOCT datasheet(6/45 Pages) TI1

Part #	WL1837MODGIMOCT

Description	WL18x7MOD WiLink 8 Dual-Band Industrial Module Wi-Fi, Bluetooth, and Bluetooth Low Energy (LE)

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Manufacturer	TI1 [Texas Instruments]

Direct Link	http://www.ti.com

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2.10

A

7.70

9.80

12.05

7.70

9.80

11.95

2.10

0.75

R0.165

0.525

0.33

0.70

0.7

0.525

Recommended Stencil

1.00

2.10

1.40

Recommended PCB Pattern

A

7.70

9.80

12.05

7.70

9.80

11.95

1.00

Surround each pad with a 0.03-mm-wide

solder mask.

0.40

0.75

0.03 All around

0.75

1.00

0.03 All around

WL1807MOD, WL1837MOD

SWRS170H – AUGUST 2014 – REVISED OCTOBER 2015

www.ti.com

Figure 4-2 shows the recommended PCB pattern of the 100-pin MOC package.

NOTE: 1. Module size: 13.4 mm × 13.3 mm

NOTE: 2. Signal pad size: 0.75 mm × 0.40 mm

NOTE: 3. 4 x corner ground size: 0.75 mm × 0.75 mm

NOTE: 4. Central ground pin size: 1.00 mm × 1.00 mm

NOTE: 5. Pitch: 0.7 mm

Figure 4-2. Recommended PCB Pattern of 100-Pin MOC Package

Figure 4-3 shows the recommended stencil outline of the 100-pin MOC package.

Figure 4-3. Recommended Stencil Outline of 100-Pin MOC Package

6

Terminal Configuration and Functions

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Product Folder Links: WL1807MOD WL1837MOD

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WL1837MODGIMOCT Datasheet(PDF) 6 Page - Texas Instruments

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