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66AK2G02 Datasheet(PDF) 2 Page - Texas Instruments

Part # 66AK2G02
Description  Multicore DSPARM KeyStone II System-on-Chip (SoC)
Download  230 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

66AK2G02 Datasheet(HTML) 2 Page - Texas Instruments

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66AK2G02, 66AK2G01
SPRS932C – DECEMBER 2015 – REVISED NOVEMBER 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: 66AK2G02 66AK2G01
Device Overview
Copyright © 2015–2016, Texas Instruments Incorporated
• Error Location Module (ELM)
– Used With the GPMC to Locate Addresses of
Data Errors From Syndrome Polynomials
Generated Using a BCH Algorithm
– Supports 4-Bit, 8-Bit and 16-Bit per 512-Byte
Block Error Location Based on BCH Algorithms
– Provides ECC Calculation (Up to 16 bits) for
NAND Support
• Network Subsystem (NSS):
• Ethernet MAC Subsystem (EMAC)
– One-Port Gigabit Ethernet: RMII, MII, RGMII
– Supports 10-, 100-, 1000-Mbps Full Duplex
– Supports 10-, 100-Mbps Half Duplex
– Supports Ethernet Audio Video Bridging (eAVB)
– Maximum Frame Size 2016 Bytes (2020 Bytes
With VLAN)
– Eight Priority Level QOS Support (802.1p)
– IEEE 1588v2 (2008 Annex D, Annex E, and
Annex F) to Facilitate Audio Video Bridging
802.1AS Precision Time Protocol
– CPTS Module With Timestamping Support for
IEEE 1588v2
– DSCP Priority Mapping (IPv4 and IPv6)
– MDIO Module for PHY Management
– Enhanced Statistics Collection
• Navigator Subsystem (NAVSS)
– Built-In Packet DMA Controller for Optimized
Network Processing
– Built-In Queue Manager (QM) for Optimized
Network Processing
– Supports up to 128 Queues
– 2048 Buffers Supported in Internal Queue
RAM
• Crypto Engine (SA) Supports:
– Crypto Function Library for AES, DES, 3DES,
SHA1, MD5, SHA2-224 and SHA2-256
Operations
– Block Data Encryption Supported Through
Hardware Cores
– AES With 128-, 192-, and 256-Bit Key
Supports
– DES and 3DES With 1, 2, or 3 Different Key
Support
– Programmable Mode Control Engine (MCE)
– Public Key Accelerator (PKA) With Elliptic Curve
Cryptography
– Elliptic Curve Diffie–Hellman (ECDH) Based Key
Exchange and Digital Signature (ECDSA)
Applications
– Authentication for SHA1, MD5, SHA2-224 and
SHA2-256
– Keyed HMAC Operation Through Hardware
Core
– True Random Number Generator (TRNG)
• Display Subsystem:
• Supports One Video Pipe With In-Loop Scaling,
Color Space
• Conversion and Background Color Overlay
• Input Data Format: BITMAP, RGB16, RGB24,
RGB32, ARGB16, ARGB32, YUV420, YUV422,
and RGB565-A8
• Supported Display Interfaces:
– MIPI® DPI 2.0 Parallel Interface
– RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
– BT.656 4:2:2
– BT.1120 4:2:2 up to 1920 × 1080 at 30fps
• In-Loop Scaling Capability
• LCD Display Interface Supports:
– Active Matrix (TFT)
– Passive Matrix (STN)
– Grayscale
– TDM
– AC Bias Control
– Dither
– CPR
• High-Speed Serial Interfaces:
• PCI Express® 2.0 Port with Integrated PHY:
– Single Lane Gen2-Compliant Port
– Root Complex (RC) and End Point (EP) Modes
• Up to Two USB 2.0 High-Speed Dual-Role Ports
With Integrated PHYs, Support:
– Dual-role-device (DRD) Capability With:
– USB 2.0 Peripheral (or Device) at
HS (480Mbps) and FS (12Mbps) Speeds
– USB 2.0 Host at HS (480Mbps),
FS (12Mbps), and LS (1.5Mbps) Speeds
– USB 2.0 Static Peripheral and Static Host
Operations
– xHCI Controller With the Following Features:
– Compatible to the xHCI Specification
(revision 1.1) in Host Mode
– All Modes of Transfer (Control, Bulk,
Interrupt, and Isochronous)
– 15 Transmit (TX), 15 Receive (RX) Endpoints
(EPs), and One Bidirectional EP0 Endpoint
• Flash Media Interfaces:
• QSPI™ With XIP and up to Four Chip Selects,
Supports:
– Memory-Mapped Direct Mode of Operation for
Performing FLASH Data Transfers and
Executing Code From FLASH Memory (XIP)
– Supports up to 96 MHz
– Internal SRAM Buffer With ECC
– High Speed Read Data Capture Mechanism


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