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V048F060T040A Datasheet(PDF) 9 Page - Vicor Corporation |
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V048F060T040A Datasheet(HTML) 9 Page - Vicor Corporation |
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9 / 18 page  NotRecommendedforNewDesigns VTM® Current Multiplier Rev 1.0 vicorpower.com Page 9 of 18 01/2014 800 927.9474 V048x060y040A 7.0 USING THE CONTROL SIGNALS VC, PC, TM, IM The VTM Control (VC) pin is an input pin which powers the internal VCC circuitry when within the specified voltage range of 11.5 V to 16.5 V. This voltage is required for VTM current multiplier start up and must be applied as long as the input is below 26 V. In order to ensure a proper start, the slew rate of the applied voltage must be within the specified range. Some additional notes on the using the VC pin: • In most applications, the VTM module will be powered by an upstream PRM® regulator which provides a 10 ms VC pulse during start up. In these applications the VC pins of the PRM regulator and VTM current multiplier should be tied together. • The VC voltage can be applied indefinitely allowing for continuous operation down to 0 VIN. • The fault response of the VTM module is latching. A positive edge on VC is required in order to restart the unit. If VC is continuously applied the PC pin may be toggled to restart the VTM module. Primary Control (PC) pin can be used to accomplish the following functions: • Delayed start: Upon the application of VC, the PC pin will source a constant 100 µA current to the internal RC network. Adding an external capacitor will allow further delay in reaching the 2.5 V threshold for module start. • Auxiliary voltage source: Once enabled in regular operational conditions (no fault), each VTM PC provides a regulated 5 V, 2 mA voltage source. • Output disable: PC pin can be actively pulled down in order to disable the module. Pull down impedance shall be lower than 400 Ω. • Fault detection flag: The PC 5 V voltage source is internally turned off as soon as a fault is detected. It is important to notice that PC doesn’t have current sink capability. Therefore, in an array, PC line will not be capable of disabling neighboring modules if a fault is detected. • Fault reset: PC may be toggled to restart the unit if VC is continuously applied. Temperature Monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC. It can be used to accomplish the following functions: • Monitor the control IC temperature: The temperature in Kelvin is equal to the voltage on the TM pin scaled by 100. (i.e. 3.0 V = 300 K = 27ºC). If a heat sink is applied, TM can be used to thermally protect the system. • Fault detection flag: The TM voltage source is internally turned off as soon as a fault is detected. For system monitoring purposes (microcontroller interface) faults are detected on falling edges of TM signal. 8.0 START UP BEHAVIOR Depending on the sequencing of the VC with respect to the input voltage, the behavior during start up will vary as follows: • Normal operation (VC applied prior to VIN): In this case the controller is active prior to ramping the input. When the input voltage is applied, the VTM module output voltage will track the input (See Figure 10). The inrush current is determined by the input voltage rate of rise and output capacitance. If the VC voltage is removed prior to the input reaching 26 V, the VTM may shut down. • Stand-alone operation (VC applied after VIN): In this case the VTM output will begin to rise upon the application of the VC voltage (See Figure 11). The Adaptive Soft Start Circuit (See Section 11) may vary the ouput rate of rise in order to limit the inrush current to its maximum level. When starting into high capacitance, or a short, the output current will be limited for a maximum of 120 µsec. After this period, the Adaptive Soft Start Circuit will time out and the VTM module may shut down. No restart will be attempted until VC is re-applied or PC is toggled. The maximum output capacitance is limited to 4000 µF in this mode of operation to ensure a sucessful start. 9.0 THERMAL CONSIDERATIONS VI Chip® products are multi-chip modules whose temperature distribution varies greatly for each part number as well as with the input/ output conditions, thermal management and environmental conditions. Maintaining the top of the V048x060y040A case to less than 100ºC will keep all junctions within the VI Chip module below 125ºC for most applications. The percent of total heat dissipated through the top surface versus through the J-lead is entirely dependent on the particular mechanical and thermal environment. The heat dissipated through the top surface is typically 60%. The heat dissipated through the J-lead onto the PCB board surface is typically 40%. Use 100% top surface dissipation when designing for a conservative cooling solution. It is not recommended to use a VI Chip module for an extended period of time at full load without proper heat sinking. |
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