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BGA2717 Datasheet(PDF) 4 Page - NXP Semiconductors |
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BGA2717 Datasheet(HTML) 4 Page - NXP Semiconductors |
4 / 14 page 9397 750 13293 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 02 — 24 September 2004 4 of 14 Philips Semiconductors BGA2717 MMIC wideband amplifier 8. Application information Figure 1 shows a typical application circuit for the BGA2717 MMIC. The device is internally matched to 50 Ω, and therefore does not need any external matching. The value of the input and output DC blocking capacitors C2 and C3 should not be more than 100 pF for applications above 100 MHz. However, when the device is operated below 100 MHz, the capacitor value should be increased. The 22 nF supply decoupling capacitor C1 should be located as close as possible to the MMIC. The printed-circuit board (PCB) top ground plane, connected to pins 2, 4 and 5 must be as close as possible to the MMIC, and ideally directly beneath it. When using via holes, use multiple via holes, located as close as possible to the MMIC. Figure 2 shows the PCB layout, used for the standard demonstration board. Fig 1. Typical application circuit. mgu435 RF_OUT RF_IN C1 C2 C3 GND2 GND1 VS VS RF input RF output 1 3 2, 5 6 4 |
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Similar Description - BGA2717 |
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