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TBF02 Datasheet(PDF) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
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TBF02 Datasheet(HTML) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
1 / 2 page 1 TBF02 THRU TBF10 SINGLE PHASE1.0AMPS. GLASS PASSIVATED BRIDGE RECTIFIERS FEATURE . Glass passivated junction. . Ideal for printed circuit board. . Reliable low cost construction utilizing molded plastic technique. . High surge current capability. . High temperature soldering guaranteed: 260℃/10 seconds at terminals. MECHANICAL DATA . Case Material: “Green” Molding compound, UL flammability classification rating 94V-0, “Free halogen” . Moisture sensitivity level:level 2a,per J-STD-020 . Polarity:Polarity as marked on the body . Weight: 0.092g (approximately) TBF - + .181(4.6) .173(4.4) .122(3.1) .106(2.7) .047(1.2) .043(1.1) .008(0.2) .004(0.1) .200(5.1) .192(4.9) .240(6.1) .224(5.7) .044(1.1) .035(0.9) .034(0.85) .021(0.55) ~ ~ - + .008(0.2) .004(0.1) .022(0.55) .014(0.35) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,resistive or inductive load. For capacitive load, derate current by 20% Type Number SYM BOL TBF02 TBF04 TBF06 TBF08 TBF10 units Maximum Recurrent Peak Reverse Voltage VRRM 200 400 600 800 1000 V Maximum RMS Voltage VRMS 140 280 420 560 700 V Maximum DC blocking Voltage VDC 200 400 600 800 1000 V Maximum Average Forward rectified Current @ TA=40℃ IF(AV) 1.0 A Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rate load (JEDEC method) IFSM 30 A Maximum Instantaneous @IF=0.5A DC Forward Voltage @IF=1.0A DC VF 0.98 1.05 V Maximum DC Reverse Current @TJ =25°C at rated DC blocking voltage @TJ =125°C IR 5.0 500.0 μA I2t Rating for Fusing (t﹤8.3ms) I2t 3.7 A2Sec Typical Junction Capacitance Per Leg (Note1) CJ 13 pF Typical Thermal Resistance (Note2) RJA 70 °C /W RJC 10 Storage Temperature TSTG -55 to +150 °C Operating Junction Temperature TJ -55 to +150 °C Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc 2. Thermal resistance from Junction to case,lead and ambient in accordance with JESD-51. Unit mounted on glass-epoxy substrate with 1oz/ft2-10×10mmcopper pad per pin with heat sink. |
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