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BU4069UBF-E2 Datasheet(PDF) 7 Page - Rohm

Part # BU4069UBF-E2
Description  Quad 2-Input Hex Inverter
Download  18 Pages
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Manufacturer  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BU4069UBF-E2 Datasheet(HTML) 7 Page - Rohm

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TSZ02201-0RDR1GZ00050-1-2
© 2013 ROHM Co., Ltd. All rights reserved.
09.Aug.2013 Rev.001
www.rohm.com
TSZ22111・15・001
BU4069UB
BU4069UBF
BU4069UBFV
Typical Performance Curves - continued
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at Ta=25°C(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol
θja (°C/W).The temperature of IC inside the package can be estimated by
this thermal resistance. Figure 10 shows the model of thermal resistance of the package. Thermal resistance
θja, ambient
temperature Ta, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below:
θja = (Tjmax-Ta) / Pd
(°C/W)
Derating curve in Figure 11 indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient is determined by thermal resistance
θja. Thermal resistance θja depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
Figure 9. “H” to ”L” Propagation Delay Time tPHL
0
50
100
150
200
250
300
350
400
-50-25
0
25
50
75100
Ambient Temperature [°C]
VDD=3V
VDD=5V
VDD=18V
VDD=10V
Operating Temperature Range
Figure 11. Derating Curve
Figure 10. Thermal resistance
周囲温度 Ta [℃]
チップ 表面温度 Tj [℃]
消費電力 P [W]
Ambient temperature Ta (℃)
Chip surface temperature Tj (℃)
Power dissipation Pd (W)
θja=(Tjmax-Ta)/Pd (°C/W)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0
25
50
75
100
125
150
Ambient Temperature [℃]
BU4069UB (DIP14)
BU4069UBF
(SOP14)
85
BU4069UBFV(SSOP-B14)


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