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MC74HC1G32DFT1 Datasheet(PDF) 2 Page - ON Semiconductor |
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MC74HC1G32DFT1 Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 8 page MC74HC1G32 http://onsemi.com 2 MAXIMUM RATINGS Symbol Parameter Value Unit VCC DC Supply Voltage *0.5 to )7.0 V VIN DC Input Voltage *0.5 to VCC )0.5 V VOUT DC Output Voltage *0.5 to VCC )0.5 V IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $20 mA IOUT DC Output Sink Current $12.5 mA ICC DC Supply Current per Supply Pin $25 mA TSTG Storage Temperature Range *65 to )150 _C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 _C TJ Junction Temperature Under Bias )150 _C qJA Thermal Resistance SC70–5/SC–88A/SOT–353 (Note 1) SOT23–5/TSOP–5/SC59–5 350 230 _C/W PD Power Dissipation in Still Air at 85 _C SC70–5/SC–88A/SOT–353 SOT23–5/TSOP–5/SC59–5 150 200 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V–0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) u2000 u200 N/A V ILATCH–UP Latch–Up Performance Above VCC and Below GND at 125_C (Note 5) $500 mA Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm–by–1 inch, 20 ounce copper trace with no air flow. 2. Tested to EIA/JESD22–A114–A. 3. Tested to EIA/JESD22–A115–A. 4. Tested to JESD22–C101–A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit VCC DC Supply Voltage 2.0 6.0 V VIN DC Input Voltage 0.0 VCC V VOUT DC Output Voltage 0.0 VCC V TA Operating Temperature Range *55 )125 _C tr , tf Input Rise and Fall Time VCC = 2.0 V VCC = 3.0 V VCC = 4.5 V VCC = 6.0 V 0 0 0 0 1000 600 500 400 ns DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES Junction Temperature °C Time, Hours Time, Years 80 1,032,200 117.8 90 419,300 47.9 100 178,700 20.4 110 79,600 9.4 120 37,000 4.2 130 17,800 2.0 140 8,900 1.0 1 1 10 100 1000 FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR Figure 3. Failure Rate vs. Time Junction Temperature TIME, YEARS |
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