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TSC2101IRGZ Datasheet(PDF) 2 Page - Texas Instruments |
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TSC2101IRGZ Datasheet(HTML) 2 Page - Texas Instruments |
2 / 90 page TSC2101 SLAS392C− JUNE 2003 − REVISED SEPTEMBER 2004 www.ti.com 2 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE/ORDERING INFORMATION PRODUCT PACKAGE PACKAGE DESIGNATOR OPERATING TEMPERATURE RANGE ORDERING NUMBER TRANSPORT MEDIA TSC2101 QFN-48 RGZ −40 °C to +85°C TSC2101IRGZ Rails, 52 TSC2101 QFN-48 RGZ −40 °C to +85°C TSC2101IRGZR Tape and Reel, 2500 PIN ASSIGNMENTS QFN PACKAGE (TOP VIEW) 13 DRVSS2 OUT8P BVDD OUT8N DRVSS1 VGND SPKFC DRVDD SPK2 SPK1 OUT32N MIC_DETECT_IN 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 IOVDD PWR_DN RESET GPIO2 GPIO1 AVDD2 AVSS2 AVDD1 X+ Y+ X− Y− 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 |
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