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SIGC158T120R3E Datasheet(PDF) 7 Page - Infineon Technologies AG |
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SIGC158T120R3E Datasheet(HTML) 7 Page - Infineon Technologies AG |
7 / 9 page SIGC158T120R3E L7698M, L7698T, L7698E 7 Rev. 2.3, 19.08.2015 Bare Die Product Specifics Test coverage at wafer level cannot cover all application conditions. Therefore it is recommended to test all characteristics which are relevant for the application at package level, including RBSOA and SCSOA. Description AQL 0.65 for visual inspection according to failure catalogue Electrostatic Discharge Sensitive Device according to MIL-STD 883 Revision History Revision Subjects (major changes since last revision) Date 2.0 Release of final datasheet, change wafer size to 200mm 30.04.2010 2.1 Additional basic types L7698M, L7698T, L7698E; new gate pad design 02.07.2014 2.2 Minor changes, chip drawing, 100% VCEsat test conditions 06.02.2015 2.3 Update disclaimer 19.08.2015 Relevant Application Notes |
Similar Part No. - SIGC158T120R3E_15 |
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Similar Description - SIGC158T120R3E_15 |
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