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SPD15P10PG Datasheet(PDF) 2 Page - Infineon Technologies AG |
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SPD15P10PG Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 10 page SPD15P10P G Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - soldering point R thJC - - 1.17 K/W Thermal resistance, junction - ambient R thJA minimal footprint, steady state -- 75 6 cm 2 cooling area1), steady state -- 45 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=-1 mA -100 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=- 1.54 mA -4 -3 -2.1 Zero gate voltage drain current I DSS V DS=-100 V, V GS=0 V, T j=25 °C - -0.1 -1 µA V DS=-100 V, V GS=0 V, T j=150 °C - -10 -100 Gate-source leakage current I GSS V GS=-20 V, V DS=0 V - -10 -100 nA Drain-source on-state resistance R DS(on) V GS=-10 V, I D=-10.6 A - 160 240 m Ω Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=-10.6 A 4.7 9.3 - S 1) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Values Rev 1. 8 page 2 20 12-09-11 |
Similar Part No. - SPD15P10PG_12 |
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Similar Description - SPD15P10PG_12 |
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