MC74HC164B

www.onsemi.com

3

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage (Referenced to GND)

– 0.5 to + 7.0

V

DC Input Voltage (Referenced to GND)

V

DC Output Voltage (Referenced to GND)

V

DC Input Current, per Pin

± 20

mA

DC Output Current, per Pin

± 25

mA

± 50

mA

Power Dissipation in Still Air,

SOIC Package†

TSSOP Package†

500

450

mW

Storage Temperature

– 65 to + 150

_C

Lead Temperature, 1 mm from Case for 10 Seconds

(SOIC or TSSOP Package)

260

_C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any

of these limits are exceeded, device functionality should not be assumed, damage may occur

and reliability may be affected.

†Derating — SOIC Package: – 7 mW/

_C from 65_ to 125_C

TSSOP Package: − 6.1 mW/

_C from 65_ to 125_C

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Max

Unit

DC Supply Voltage (Referenced to GND)

2.0

6.0

V

DC Input Voltage, Output Voltage (Referenced to

GND)

0

V

Operating Temperature, All Package Types

– 55

+ 125

_C

Input Rise and Fall Time

(Figure 1)

0

0

0

No Limit

No Limit

No Limit

ns

Functional operation above the stresses listed in the Recommended Operating Ranges is not

implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may

affect device reliability.

This device contains protection

circuitry to guard against damage

due to high static voltages or electric

fields. However, precautions must

be taken to avoid applications of any

voltage higher than maximum rated

voltages to this high−impedance cir-

range GND

Unused inputs must always be

tied to an appropriate logic voltage

Unused outputs must be left open.