MC74HC164B

www.onsemi.com

8

PACKAGE DIMENSIONS

TSSOP−14

DT SUFFIX

CASE 948G

ISSUE B

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

4.90

5.10

0.193

0.200

B

4.30

4.50

0.169

0.177

C

−−−

1.20

−−−

0.047

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.65 BSC

0.026 BSC

H

0.50

0.60

0.020

0.024

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.19

0.30

0.007

0.012

K1

0.19

0.25

0.007

0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

___

_

S

U

0.15 (0.006) T

2X

L/2

S

U

M

0.10 (0.004)

T

L

−U−

SEATING

PLANE

0.10 (0.004)

−T−

SECTION N−N

DETAIL E

J J1

K

K1

DETAIL E

F

M

−W−

0.25 (0.010)

8

14

7

1

PIN 1

IDENT.

H

G

A

D

C

B

S

U

0.15 (0.006) T

−V−

14X

REF

K

N

N

7.06

14X

0.36

14X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.