MC74AC157, MC74ACT157

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3

MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

DC Supply Voltage

*0.5 to )7.0

V

DC Input Voltage

V

DC Output Voltage

(Note 1)

V

DC Input Diode Current

$20

mA

DC Output Diode Current

$50

mA

DC Output Sink/Source Current

$50

mA

DC Supply Current per Output Pin

$50

mA

DC Ground Current per Output Pin

$50

mA

Storage Temperature Range

*65 to )150

°C

Lead temperature, 1 mm from Case for 10 Seconds

260

°C

Junction temperature under Bias

)150

°C

Thermal Resistance (Note 2)

SOIC

TSSOP

69.1

103.8

°C/W

Power Dissipation in Still Air at 65

°C (Note 3)

SOIC

TSSOP

500

500

mW

MSL

Moisture Sensitivity

Level 1

Flammability Rating

Oxygen Index: 30% − 35%

UL 94 V−0 @ 0.125 in

ESD Withstand Voltage

Human Body Model (Note 4)

Machine Model (Note 5)

Charged Device Model (Note 6)

> 2000

> 200

> 1000

V

Latch−Up Performance

$100

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. The package thermal impedance is calculated in accordance with JESD51−7.

3. 500 mW at 65

°C; derate to 300 mW by 10 mW/ from 65°C to 85°C.

4. Tested to EIA/JESD22−A114−A.

5. Tested to EIA/JESD22−A115−A.

6. Tested to JESD22−C101−A.

7. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

Min

Typ

Max

Unit

Supply Voltage

′AC

2.0

5.0

6.0

V

′ACT

4.5

5.0

5.5

DC Input Voltage, Output Voltage (Ref. to GND)

0

−

V

Input Rise and Fall Time (Note 1)

′AC Devices except Schmitt Inputs

−

150

−

−

40

−

ns/V

−

25

−

Input Rise and Fall Time (Note 2)

′ACT Devices except Schmitt Inputs

−

10

−

ns/V

−

8.0

−

Junction Temperature (PDIP)

−

−

140

°C

Operating Ambient Temperature Range

−40

25

85

°C

Output Current − High

−

−

−24

mA

Output Current − Low

−

−

24

mA

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.