Electronic Components Datasheet Search |
|
TLVx170 Datasheet(PDF) 7 Page - Texas Instruments |
|
TLVx170 Datasheet(HTML) 7 Page - Texas Instruments |
7 / 38 page 7 TLV170, TLV2170, TLV4170 www.ti.com SBOS782 – NOVEMBER 2016 Product Folder Links: TLV170 TLV2170 TLV4170 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: TLV170 THERMAL METRIC(1) TLV170 UNIT D (SOIC) DBV (SOT-23) 8 PINS 5 PINS RθJA Junction-to-ambient thermal resistance 149.5 245.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 97.9 133.9 °C/W RθJB Junction-to-board thermal resistance 87.7 83.6 °C/W ψJT Junction-to-top characterization parameter 35.5 18.2 °C/W ψJB Junction-to-board characterization parameter 89.5 83.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: TLV2170 THERMAL METRIC(1) TLV2170 UNIT D (SOIC) DGK (VSSOP) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 134.3 180 °C/W RθJC(top) Junction-to-case (top) thermal resistance 72.1 55 °C/W RθJB Junction-to-board thermal resistance 60.6 130 °C/W ψJT Junction-to-top characterization parameter 18.2 5.3 °C/W ψJB Junction-to-board characterization parameter 53.8 120 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.6 Thermal Information: TLV4170 THERMAL METRIC(1) TLV4170 UNIT D (SOIC) PW (TSSOP) 14 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 93.2 106.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 51.8 24.4 °C/W RθJB Junction-to-board thermal resistance 49.4 59.3 °C/W ψJT Junction-to-top characterization parameter 13.5 0.6 °C/W ψJB Junction-to-board characterization parameter 42.2 54.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W |
Similar Part No. - TLVx170 |
|
Similar Description - TLVx170 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |