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AS12J10R0ET Datasheet(PDF) 1 Page - Ohmite Mfg. Co.

Part # AS12J10R0ET
Description  Reduction of assembly costs
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Manufacturer  OHMITE [Ohmite Mfg. Co.]
Direct Link  http://www.ohmite.com
Logo OHMITE - Ohmite Mfg. Co.

AS12J10R0ET Datasheet(HTML) 1 Page - Ohmite Mfg. Co.

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1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
6
AS Series
Anti-surge Thick Film Chip Resistors
Fe A ture S
•Smallsizeandlightweight
•Suitableforbothwaveandreflowsoldering
•Canwithstandhighsurge
•Reductionofassemblycosts
Serie S S peci F ic Ation S
c h A r A cteri S tic S
Power
Max
Max
Dielectric
Rating
Working
Overload
Withstanding
Resistance
Type
at 70°C
Voltage
Voltage
Voltage
Range
AS08 (0805)
0.33W
150V
300V
500V
1Ω~10MΩ
AS12 (1206)
0.5W
200V
400V
500V
1Ω~10MΩ
AS25 (2512)
1.5W
500V
500V
500V
1Ω~20MΩ
Std. Oper. Temp. -55°C ~ +155°C
Standard Values E-24 values
Construction Thick film
Tolerance ±5% standard; ±10%
and ±20% available
Derating
Reflow
100
Ambient Temperature, °C
60
20
0
80
40
050
100
155
70
-55
300
Time
Preheating
150° ~ 180°
90 ±30sec.
Soldering
Cooling
200
50
0
250
100
150
230° ~ 245°/250°
20 ±10sec.
Test
ΔR
Test Methods (JIS C 5201-1 )
Temperature
Coefficient
1Ω-10Ω: ≤ ±400PPM/°C
(±200 PPM can be provid-
ed on a case to case basis)
11Ω-10MΩ: ≤ ±100PPM/°C
Natural ΔR/°C
R2-R1 x 106 (PPM/°C)
R1(t2-t1)
R1: at room temp. (T1)
R2: at room temp. plus 100°C (T2)
Test pattern: room temp. (T1), room
temp. +100°C(T2)
Short Time
Overload
±(1.0% + 0.1Ω) max.
Permanent ΔR after the application of a
potential of 2.5 times RCWV for 5 sec.
Terminal
Bending
±(1.0% + 0.05Ω) max.
Twist of Test Board: Y/X = 3/90 mm for
60 sec.
Soldering Heat ±(1.0% + 0.05Ω) max.
260°C±3°C for 10 ±1 sec.
Single Pulse ±(1.0% + 0.1Ω) max.
See graph on next page.
Humidity ±(3.0% + 0.1Ω) max.
Temporary ΔR after 240 hr. at 40 ±2°C
and 90-95% relative humidity
Load Life in
Humidity
±(3.0% + 0.1Ω) max.
ΔR after 1,000 hr. (1.5 hr. "on", 0.5 hr.
"off" ) at RCWV at 40 ±2°C and 90-95%
relative humidity
Load Life ±(3.0% + 0.1Ω) max.
ΔR change after 1,000 hr. operat-
ing at RCWV, with duty cycle of (1.5
hours"on", 0.5 hour"off") at 70°C ±2°C
ambient
Solderability Min. 95% coverage
Wave Solder: 245°C ±3°C for 2-3 sec.
Temperature
Cycling
±(1.0% + 0.05Ω) max.
ΔR after 5 cycles:
-55°C ±3°C 30 min.
Room temp. 10-15 min.
+155°C ±2°C 30 min.
4 Room temp. 10-15 min.
Dielectric
withstanding
voltage
No evidence of flashover,
mechanical damage, arcing
or insulation breakdown
Clamped in the trough of a 90°C metal-
lic v-block at specified AC potential
60-70 sec.


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