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STM32F427XX Datasheet(PDF) 16 Page - STMicroelectronics

Part No. STM32F427XX
Description  ARM Cortex-M4 32b MCUFPU, 225DMIPS, up to 2MB Flash/2564KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 20 comm. interfaces, camera & LCD-TFT
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32F427XX Datasheet(HTML) 16 Page - STMicroelectronics

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Communication
interfaces
SPI / I2S
4/2 (full duplex)(2)
6/2 (full duplex)(2)
I2C
3
USART/
UART
4/4
USB OTG
FS
Yes
USB OTG
HS
Yes
CAN
2
SAI
1
SDIO
Yes
Camera interface
Yes
LCD-TFT (STM32F429xx
only)
No
Yes
No
Yes
No
Yes
No
Yes
Chrom-ART Accelerator™
Yes
GPIOs
82
114
130
140
168
12-bit ADC
Number of channels
3
16
24
12-bit DAC
Number of channels
Yes
2
Maximum CPU frequency
180 MHz
Operating voltage
1.8 to 3.6 V(3)
Operating temperatures
Ambient temperatures: –40 to +85 °C /–40 to +105 °C
Junction temperature: –40 to + 125 °C
Packages
LQFP100
WLCSP143
LQFP144
UFBGA169
UFBGA176
LQFP176
LQFP208
TFBGA216
1.
For the LQFP100 package, only FMC Bank1 or Bank2 are available. Bank1 can only support a multiplexed NOR/PSRAM memory using the NE1 Chip Select. Bank2 can only support a 16- or 8-bit
NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. For UFBGA169 package, only SDRAM, NAND and multiplexed
static memories are supported.
2.
The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode.
3.
VDD/VDDA minimum value of 1.7 V is obtained when the device operates in reduced temperature range, and with the use of an external power supply supervisor (refer to Section 3.17.2: Internal reset
OFF).
Table 2. STM32F427xx and STM32F429xx features and peripheral counts (continued)
Peripherals
STM32F427
Vx
STM32F429Vx
STM32F427
Zx
STM32F429Zx
STM32F427
Ax
STM32F429
Ax
STM32F427
Ix
STM32F429Ix
STM32F429Bx
STM32F429Nx


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