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VND7004AY Datasheet(PDF) 35 Page - STMicroelectronics |
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VND7004AY Datasheet(HTML) 35 Page - STMicroelectronics |
35 / 47 page VND7004AY Package and PCB thermal data DocID027772 Rev 9 35/47 Table 14: PCB properties Dimension Value Board finish thickness 1.6 mm +/- 10% Board dimension 129 mm x 60 mm Board Material FR4 Copper thickness (top and bottom layers) 0.070 mm Copper thickness (inner layers) 0.035 mm Thermal vias separation 1.2 mm Thermal via diameter 0.3 mm +/- 0.08 mm Copper thickness on vias 0.025 mm Footprint dimension (top layer) 4.1 mm x 6.5 mm Heatsink copper area dimension (bottom layer) Footprint, 2 cm2 or 8 cm2 Figure 40: Rthj-amb vs PCB copper area in open box free air conditions 30 35 40 45 50 55 60 65 0 2 4 6 8 10 RTHjamb RTHjamb |
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