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TPS62130A-Q1_016 Datasheet(PDF) 4 Page - Texas Instruments

Part # TPS62130A-Q1_016
Description  3-V to 17-V 3-A Step-Down Converter with DCS-Control
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS62130A-Q1_016 Datasheet(HTML) 4 Page - Texas Instruments

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TPS62130A-Q1, TPS62133A-Q1, TPS6213013A-Q1
SLVSCC2B – MAY 2014 – REVISED NOVEMBER 2016
www.ti.com
Product Folder Links: TPS62130A-Q1 TPS62133A-Q1 TPS6213013A-Q1
Submit Documentation Feedback
Copyright © 2014–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to network ground terminal.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
MIN
MAX
UNIT
Pin voltage (2)
AVIN, PVIN
–0.3
20
V
EN, SS/TR, SW
–0.3
VIN+0.3
DEF, LOG, FB, PG, VOS
–0.3
7
V
Power Good sink current PG
10
mA
Temperature
Operating junction temperature, TJ
–40
150
°C
Storage temperature
Tstg
–65
150
°C
(1)
Electrostatic discharge (ESD) measures device sensitivity and immunity to damage caused by assembly line electrostatic discharges
into the device.
(2)
AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
(1)
Electrostatic
discharge
Human body model (HBM), per AEC Q100-002(2)
±2000
V
Charged device model (CDM), per AEC Q100-011
±500
7.3 Recommended Operating Conditions
MIN
TYP
MAX
UNIT
VIN
Supply Voltage
at AVIN and PVIN
3
17
V
VOUT
Output Voltage Range
TPS62130A-Q1
0.9
6
V
TJ
Operating junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.4 Thermal Information
THERMAL METRIC(1)
TPS6213xA-Q1
UNIT
RGT
16 PINS
RθJA
Junction-to-ambient thermal resistance
45
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
53.6
°C/W
RθJB
Junction-to-board thermal resistance
17.4
°C/W
ψJT
Junction-to-top characterization parameter
1.1
°C/W
ψJB
Junction-to-board characterization parameter
17.4
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
4.5
°C/W


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