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TPS62162-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62162-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page 4 TPS62160-Q1, TPS62162-Q1 SLVSCK6A – DECEMBER 2014 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TPS62160-Q1 TPS62162-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability. (2) All voltages are with respect to network ground terminal. 8 Specifications 8.1 Absolute Maximum Ratings over operating junction temperature range (unless otherwise noted) (1) MIN MAX UNIT Pin voltage range(2) VIN –0.3 20 V EN, SW –0.3 VIN+0.3 V FB, PG, VOS –0.3 7 V Power Good sink current PG 10 mA Operating junction temperature range, TJ –40 150 °C Storage temperature range, Tstg –65 150 °C (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 8.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V Charged device model (CDM), per AEC Q100-011 ±500 8.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Supply voltage 3 17 V VOUT Output voltage range 0.9 6 V TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 8.4 Thermal Information THERMAL METRIC(1) TPS6216x-Q1 UNIT DSG (8 PINS) RθJA Junction-to-ambient thermal resistance 65.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 66.4 °C/W RθJB Junction-to-board thermal resistance 35.5 °C/W ψJT Junction-to-top characterization parameter 1.7 °C/W ψJB Junction-to-board characterization parameter 35.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 8.4 °C/W |
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